? all specifications are subject to change without notice. conformity to rohs directive: this means that, in conformity with eu directive 2002/95/ec, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, pbb and pbde, have not been used, except for exempted applications. multilayer chip beads(smd array) for signal line mza series type: issue date: mza1210 [0504 inch]* (2 lines) mza2010 [0804 inch] (4 lines) * dimensions code jis[eia] may 2011
all specifications are subject to change without notice. (1/6) 001-03 / 20110509 / e9421_mza chip beads(smd array) for general signal line mza series mza1210 type features a single mza series chip provides noise attenuation for two lines, making it ideal for use with i/o lines of various highly miniaturized. electronic equipment, such as portable products, which comprise high density circuitry. low crosstalk between adjacent circuits. internal electrodes feature low dc resistance, minimizing wasteful power consumption. electroplated terminal electrodes accommodate reflow soldering. monolithic structure ensures high reliability. the products contain no lead and also support lead-free soldering. it is a product conforming to rohs directive. applications removal of signal line noises of cellular phones, pcs, note pcs, tvs, dvds, dscs, game machines, digital photo frames, pnds, etc. product identification (1) series name (2) dimensions l w (3) material code (4) nominal impedance 121:120 ? at 100mhz (5) characteristic type (6) packaging style t:taping handling and precautions before soldering, be sure to preheat components. the preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150c. after mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. do not expose the inductors to stray magnetic fields. avoid static electricity discharge during handling. when hand soldering, apply the soldering iron to the printed cir- cuit board only. temperature of the iron tip should not exceed 350c. soldering time should not exceed 3 seconds. this product does not apply to flow soldering construction method. shapes and dimensions/recommended pc board patt er n circuit diagram temperature ranges packaging style and quantities recommended soldering condition reflow soldering conformity to rohs directive mza 1210 d 121 c t (1) (2) (3) (4) (5) (6) operating/storage ?55 to +125c packaging style quantity taping 5000 pieces/reel 1.25 0.15 0.20 0.15 1.00 0.15 0.50 0.10 0.65 0.10 weight: 3mg dimensions in mm 0.35 0.15 0.35 0.15 0.5 0.5 0.4 0.3 ? no polarity natural cooling 10s max. preheating 60 to 120s soldering 30 to 60s 230?c 250 to 260?c 180?c 150?c time(s) please contact our sales office when your application is considered the following: the device?s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) conformity to rohs directive: this means that, in conformity with eu directive 2002/95/ec, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, pbb and pbde, have not been used, except for exempted applications.
all specifications are subject to change without notice. (2/6) 001-03 / 20110509 / e9421_mza electrical characteristics ? test equipment : e4991a or equivalent test tool : 16192a or equivalent test temperature: 2510c typical electrical characteristics z, x, r vs. frequency characteristics mza1210d330c mza1210d680c mza1210d121c mza1210d241c packaging styles reel dimensions tape dimensions part no. impedance ( ? )[100mhz] ? dc resistance ( ? )max. rated current (ma)max. rated voltage (v)max. mza1210d330c 3325% 0.30 50 5 mza1210d680c 6825% 0.50 50 5 mza1210d121c 12025% 0.80 50 5 mza1210d241c 24025% 1.20 50 5 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 z x r 50 100 150 200 250 500 400 300 200 100 0 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) z x r 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 100 200 300 400 500 600 700 800 z x r 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 z x r 200 400 600 800 1000 1200 1400 1600 1.0 ?180 2.0 2.0 0.5 ?13 0.2 ?21 0.8 ?60min. 14.4max. dimensions in mm 8.4 +2.0 ?0.0 8.0 0.3 3.5 0.05 1.75 0.1 4.0 0.1 4.0 0.1 2.0 0.05 1.5 +0.1 ?0.0 sprocket hole cavity 1.45 0.2 0.8max. 1.2 0.2 160min. taping 200min. 300min. drawing direction dimensions in mm
all specifications are subject to change without notice. (3/6) 001-03 / 20110509 / e9421_mza chip beads(smd array) for general signal line mza series mza2010 type features a single mza series chip provides noise attenuation for four lines, making it ideal for use with i/o lines of various highly miniaturized. electronic equipment, such as portable products, which comprise high density circuitry. low crosstalk between adjacent circuits. internal electrodes feature low dc resistance, minimizing wasteful power consumption. electroplated terminal electrodes accommodate reflow soldering. monolithic structure ensures high reliability. it is a product conforming to rohs directive. applications removal of signal line noises of cellular phones, pcs, note pcs, tvs, dvds, dscs, game machines, digital photo frames, pnds, etc. product identification (1) series name (2) dimensions l w (3) material code (4) nominal impedance 121:120 ? at 100mhz (5) characteristic type (6) packaging style t:taping handling and precautions before soldering, be sure to preheat components. the preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150c. after mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. do not expose the inductors to stray magnetic fields. avoid static electricity discharge during handling. when hand soldering, apply the soldering iron to the printed cir- cuit board only. temperature of the iron tip should not exceed 350c. soldering time should not exceed 3 seconds. this product does not apply to flow soldering construction method. material characteristics b material: this type is perfectly suited for fast digital signals. by equalizing r components and x components that beads possess at a frequency of 5mhz, it is able to suppress overshooting, undershooting and ringing of fast digital signals. s material: standard type that features impedance characteristics similar to those of a typical ferrite core. for signal line applications in which the blocking region is near 100mhz. impedance values selected for effec- tiveness at 40 to 300mhz. y material: high frequency range type intended for the 100mhz region and above. for signal line applications in which the signal fre- quency is far from the cutoff frequency. impedance val- ues selected for effectiveness at 80 to 400mhz. d material: for applications calling for low insertion loss at low fre- quencies and sharply increasing impedance at high frequencies. designed for high impedance at high fre- quencies (300mhz to 1ghz) for signal line applica- tions. f material: this new product inherits the characteristic of our d- material, namely its sharp impedance rise time, and its impedance peak frequency has been shifted higher into range. the product offers excellent noise suppres- sion from 600mhz to as high as in the ghz range. typical material characteristics conformity to rohs directive mza 2010 d 121 c t (1) (2) (3) (4) (5) (6) b s d y 0 200 400 600 800 1000 1200 1400 1600 1800 2000 10 100 1000 frequency(mhz) impedance ( ? ) f please contact our sales office when your application is considered the following: the device?s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) conformity to rohs directive: this means that, in conformity with eu directive 2002/95/ec, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, pbb and pbde, have not been used, except for exempted applications.
all specifications are subject to change without notice. (4/6) 001-03 / 20110509 / e9421_mza shapes and dimensions/recommended pc board patt er n circuit diagram temperature ranges packaging style and quantities recommended soldering condition reflow soldering electrical characteristics ? test equipment : e4991a or equivalent test tool : 16192a or equivalent test temperature: 2510c operating/storage ?55 to +125c packaging style quantity taping 5000 pieces/reel dimensions in mm weight: 5mg 0.5 0.1 0.5 0.1 1.0 0.15 2.0 0.15 0.2 0.15 0.6 0.6 0.6 0.5 0.25 ferrite terminal electrode 0.25+0.15/?0.10 no polarity natural cooling 10s max. preheating 60 to 120s soldering 30 to 60s 230?c 250 to 260?c 180?c 150?c time(s) part no. impedance ( ? )[100mhz] ? dc resistance ( ? )max. rated current (ma)max. rated voltage (v)max. mza2010b241c 24025% 0.45 100 5 mza2010s800c 8025% 0.22 100 5 mza2010s121c 12025% 0.25 100 5 mza2010s241c 24025% 0.35 100 5 mza2010s601c 60025% 0.50 100 5 mza2010s102c 100025% 0.75 100 5 mza2010y800c 8025% 0.30 100 5 mza2010y121c 12025% 0.40 100 5 mza2010y241c 24025% 0.60 100 5 mza2010y601c 60025% 0.80 100 5 mza2010y102c 100025% 1.00 100 5 mza2010d330c 3325% 0.30 50 5 mza2010d680c 6825% 0.50 50 5 mza2010d121c 12025% 0.80 50 5 mza2010d241c 24025% 1.20 50 5 mza2010f330c 3325% 0.60 100 5 mza2010f470c 4725% 0.80 100 5 mza2010f560c 5625% 0.80 100 5
all specifications are subject to change without notice. (5/6) 001-03 / 20110509 / e9421_mza typical electrical characteristics z, x, r vs. frequency characteristics mza2010b241c mza2010s800c mza2010s121c mza2010s241c mza2010s601c mza2010s102c mza2010y800c mza2010y121c mza2010y241c mza2010y601c mza2010y102c mza2010d330c 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 r x z 50 100 150 200 250 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 50 100 150 200 250 300 r x z 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 r x z 20 40 60 80 100 120 140 1400 1200 1000 800 600 400 200 0 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) r x z 400 350 300 250 200 150 100 50 0 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) r x z 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 r x z 100 200 300 400 500 600 700 800 900 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 r x z 50 100 150 200 250 300 350 400 450 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 r x z 20 40 60 80 100 120 140 160 180 300 250 200 150 100 50 0 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) r x z 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 50 100 150 200 250 r x z 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 r x z 200 400 600 800 1000 1400 1200 1000 800 600 400 200 0 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) r x z
all specifications are subject to change without notice. (6/6) 001-03 / 20110509 / e9421_mza typical electrical characteristics z, x, r vs. frequency characteristics mza2010d680c mza2010d121c mza2010d241c mza2010f330c mza2010f470c mza2010f560c packaging styles reel dimensions tape dimensions x z r impedance ( ? ) 0 400 800 1200 1600 200 600 1000 1400 1 10 100 frequency ( mhz ) 1000 10000 0 100 200 300 400 500 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) r x z impedance ( ? ) 0 200 400 600 800 100 300 500 700 1 10 100 frequency ( mhz ) 1000 10000 x z r 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 r x z 200 400 600 800 1000 1200 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 r x z 100 200 300 400 500 600 700 1 10 100 1000 10000 frequency ( mhz ) impedance ( ? ) 0 100 200 300 400 500 600 700 800 900 r x z 1.0 ?180 2.0 2.0 0.5 ?13 0.2 ?21 0.8 ?60min. 14.4max. dimensions in mm 8.4 +2.0 ?0.0 8.0 0.3 3.5 0.05 1.75 0.1 4.0 0.1 4.0 0.1 2.0 0.05 1.5 +0.1 ?0.0 sprocket hole cavity 2.3 0.2 0.8max. 1.3 0.2 160min. taping 200min. 300min. drawing direction dimensions in mm
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